Architecture of a TDI test-chip embedding a 5 μm pitch pixel, 200 stages, bi-directional TDI pixel fabricated in a BSI technology

In this paper we describe the architecture of a TDI test-chip embedding a 5µm pitch pixel, 200 stages, bidirectional TDI pixel fabricated in a BSI technology. This pixel makes use of a unique CDTI based transfer register. The obtained performances are presented and compared to other state-of-the-art CCD-on-CMOS published works. Keywords— Time delay Integration (TDI), CCD-on-CMOS, Back Side Illumination (BSI), Bi-directional, anti-blooming, Modulation transfer function (MTF) Time delay Integration (TDI), CCD-on-CMOS, Back Side Illumination (BSI), Bidirectional, anti-blooming, Modulation transfer function (MTF)

J. Michelot, JB Mancini, M. Hadji, M. Guillon, P. Monsinjon, S. Caranhac  –  International Image Sensor Workshop, Crieff, Scotland May 2023.

Presentation is available **here **for download